| with a carefully selected potting compound to combat humidity and moisture issues. The injection flow path has been studied and has been shown to not leave any voids. Also the board is flushed with solvent to remove flux after assembly and again after being soldered into the case prior to potting to prevent potential ionizing pathways. Dendrite formation is most likely in cases where contamination persists after cleaning. To address your issue at work I would look towards tighter process control with respect to residues. The paper linked below has some great info correlating ionic residue concentrations with the probably of dentritic growth. Cleanliness correlation to reliability
www.selindesign.net 
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